首页> 外文会议>Symposium on Three-Dimensional Nanoengineered Assemblies Dec 1-5, 2002 Boston, Massachusetts, U.S.A. >Morphology Evolution of Pyramid-like Nanostructures on Cobalt Thin Films during Deposition by Sputtering
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Morphology Evolution of Pyramid-like Nanostructures on Cobalt Thin Films during Deposition by Sputtering

机译:溅射沉积钴薄膜上金字塔状纳米结构的形貌演变

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The cobalt thin films are grown by D.C. magnetron sputtering as a function of the target-to-substrate distance, bias and power on both Si (100) and (111) substrates. The crystal structure and morphology of the thin films are characterized by 4-point probe, x-ray diffraction, scanning electron microscopy, transmission electron microscopy and atomic force microscopy. It is found that the cobalt crystal structure can be varied from HCP to FCC by varying the target-to-substrate distance from 6 to 10 cm. The resistivity, roughness and the preferred orientation of the thin films are greatly affected by the substrate bias and power. The lowest resistivity of Co films is 9.8 μ Ω -cm when deposited at the target-to-substrate distance of 6cm, the applied power of 50W and the substrate bias of -75 volts. In addition, pyramid-like nanostructures with sharp tips are formed on the surface of the thin films when negative bias is applied. The faceted planes on the nanostructures depend on the resulting Co crystal structure while the size and density are determined by the growth parameters. The evolution of the surface nanostructures are systematically examined as a function of substrate bias and thin film thickness. The formation mechanism of the surface nanostructures is discussed in the paper.
机译:钴薄膜是通过直流磁控溅射法在Si(100)和(111)基板上生长的靶-基板距离,偏压和功率的函数。薄膜的晶体结构和形貌通过四点探针,X射线衍射,扫描电子显微镜,透射电子显微镜和原子力显微镜表征。发现通过将靶到衬底的距离从6 cm更改为10 cm,可以将钴晶体结构从HCP改变为FCC。薄膜的电阻率,粗糙度和优选的取向在很大程度上受到衬底偏压和功率的影响。当在目标到基板的距离为6cm,施加的功率为50W且基板偏置为-75伏时,Co膜的最低电阻率为9.8μΩ-cm。另外,当施加负偏压时,在薄膜的表面上形成具有尖锐尖端的金字塔状纳米结构。纳米结构上的刻面取决于所产生的钴晶体结构,而尺寸和密度则取决于生长参数。系统地检查了表面纳米结构的演变与衬底偏压和薄膜厚度的关系。本文讨论了表面纳米结构的形成机理。

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