首页> 外文会议>Symposium on In Situ Process Diagnostics and Modelling held April 6-7, 1999, San Francisco, California, U.S.A. >Real-time spectroscopic ellipsometry study of the thermal cleaning process for silicon epitaxial growth by uhv-cvd
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Real-time spectroscopic ellipsometry study of the thermal cleaning process for silicon epitaxial growth by uhv-cvd

机译:通过UHV-CVD对硅外延生长进行热清洗的实时光谱椭圆仪研究

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摘要

Real-time spectroscopic ellipsometry (RTSE) method was applied to study thermal cleaning process of silicon surfaces for epitaxial growth by ultra-high vacuum chemical vapor deposition (UHV-CVD). For the first time, in-situ observation of oxide decomposition process under Si_2H_6 ambience was carried out. The substrates with thin oxide formed by wet chemical treatment were heated up by infrared heater under UHV or under Si_2H_6 ambience in an UHV-CVD chamber and the oxide decomposition processes were observed by RTSE. Ellipsometric parameters Psi and Delta increase with the progress of oxide decomposition process and become constant with the completion of the decomposition. It was found that the oxide decomposition process consists of two phases and rate-determing processes are different in each phase. It was also found that Si_2H_6 lowers the activation energies of oxide decomposition process in each phase.
机译:实时光谱椭圆仪(RTSE)方法被用于研究硅表面的热清洗工艺,通过超高真空化学气相沉积(UHV-CVD)进行外延生长。首次在Si_2H_6气氛下进行了氧化物分解过程的原位观察。在UHV-CVD室内,在UHV或Si_2H_6环境下,通过红外加热器将通过湿化学处理形成的具有薄氧化物的基板加热,并通过RTSE观察氧化物分解过程。椭偏参数Psi和Delta随着氧化物分解过程的进行而增加,并随着分解的完成而变得恒定。发现氧化物分解过程由两个阶段组成,并且速率确定过程在每个阶段中都不同。还发现Si_2H_6降低了各相中氧化物分解过程的活化能。

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