Novel Copper Powders and Flakes for Electronic Applications

摘要

This paper presents a new line of copper powders and flakes, which are suitable for electronic applications in general and MLCC electrodes in particular. The primary particle size of the copper powders can be accurately controlled in a wide range (0.2 to 5.0 micrometers), are uniform, highly crystalline, and display a very good oxidation resistance. The novel milling process used in the preparation of the copper flakes ensures a good size control in the 3.0 to 10.0 micrometers range, a tight panicle size distribution, a very good oxidation resistance, and an excellent dispersibility in typical paste vehicles. The aspect ratio of the flakes can be tailored during the manufacturing process to address a wide range of applications from MLCC BM terminations to EMI shielding.