首页> 外文会议>Symposium on Microphotonics-Materials, Physics and Applications held Nov 27-29, 2000, Boston, Massachusetts, U.S.A. >Fabrication and Characterization of 2-Dimensional AIGaAs Photonic Crystals with High Aspect Ratio Hole Patterns by C1_2 RIBE
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Fabrication and Characterization of 2-Dimensional AIGaAs Photonic Crystals with High Aspect Ratio Hole Patterns by C1_2 RIBE

机译:C1_2 RIBE制备高深宽比孔型二维AIGaAs光子晶体及其表征

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AlGaAs-based two-dimensional photonic crystal (PC) slab waveguide devices have been fabricated using electron beam (EB) lithography and a reactive ion beam etching (RIBE) technology. Air hole-based triangular lattices with lattice constants ranging from 0.32 to 0.45 have been fabricated on three kinds of structures, that is, semiconductor-clad (SC), air-bridge (AB) and oxide-clad (OC) structures. For the SC-type structure, periodic air-hole structures were fabricated in an MBE grown 0.5 μ-thick Al_(0.1)Ga_(0.9)As waveguide (core) layer and a 2.0 μm-thick Al_(0.35)Ga_(0.65) As cladding layer on a GaAs substrate. The etch depth of the air hole is 0.9μm. A series of samples were prepared with air-filling factors in the range of 0.3 to 0.5. The AB-type structure, giving strong optical confinement, was fabricated by selective wet chemical etching. After wet etching the air-filling factors measured for different samples ranged from 0.47 to 0.64. An OC-type structure, with a cladding layer with a much lower refractive index as compared to the core layer, was fabricated by selective wet thermal oxidation of the AI_(0.93)Ga_(0.07)As layer. Each PC structure was sandwiched with a pair of 3-μm-wide dry-etched stripe waveguides. In the transmission/reflection spectra with a wavelength ranging from 0.85 to 1.1 μm on three such kinds of devices, band-gaps with a large attenuation of more than 30 dB were observed.
机译:使用电子束(EB)光刻和反应离子束蚀刻(RIBE)技术已经制造了基于AlGaAs的二维光子晶体(PC)平板波导器件。已经在三种结构上制造了具有在0.32至0.45范围内的晶格常数的基于气孔的三角晶格,即,半导体包覆(SC),气桥(AB)和氧化物包覆(OC)结构。对于SC型结构,在生长0.5μ厚的Al_(0.1)Ga_(0.9)As波导(芯)层和2.0μm厚的Al_(0.35)Ga_(0.65)的MBE中制造周期性的气孔结构作为GaAs基板上的覆层。气孔的蚀刻深度为0.9μm。制备了一系列样品,其充气系数在0.3到0.5的范围内。通过选择性湿法化学刻蚀来制造具有强光学限制的AB型结构。湿法蚀刻后,对不同样品测得的充气系数范围为0.47至0.64。通过Al_(0.93)Ga_(0.07)As层的选择性湿热氧化来制造具有与芯层相比折射率低得多的包覆层的OC型结构。每个PC结构都夹有一对3μm宽的干蚀刻条纹波导。在三种类型的器件上的波长范围为0.85至1.1μm的透射/反射光谱中,观察到带隙的衰减大于30 dB。

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