SCALING ANALYSIS OF ROUGHNESS DURING SILVER ELECTRODEPOSITION

摘要

This work represents the first time that scaling analysis has been used to study silver electrodeposition from sodium and ammonium thiosulfate solutions. Empirical observations of silver plated from these solutions indicates that the plate made from sodium thiosulfate solution is macroscopically smoother than that plated from ammonium thiosulfate solution. Using scaling analysis, differences were found in the mechanism of silver electrodeposition that explains the differences. Silver electrodeposition from ammonium thiosulfate solution is dominated by surface diffusion and step growth, and from sodium thiosulfate solution the surface growth is dominated by erosion of asperities and filling in of surface recesses. Atomic Force Microscope (AFM) images of the surfaces confirmed the scaling analysis results.