a-Si TFTs on thin steel foil substrates: how thin CAN We GO?

摘要

The mechanics of thin film-substrate couples indicates that mechanical stress in the active electronic payer can be reduced when films are deposited onto thinner substrates. To explore the question of just how thin a substrate can be, a-Si:H TFTS are fabricated on thin steel foil substrates of various thickness, and performance metrics from devices on each of the substrates are measured and compared.