A-Si TFTs on thin steel foil substrates: how thin can we go?

摘要

The mechanics of thin film-substrate couples indicates that mechanical stress in the active electronic layer can be reduced when films are deposited onto thinner substrates. To explore the question of just how thin a substrate can be, a-Si:H TFTsare fabricated on thin steel foil substrates of various thickness, and performance metrics from devices on each of the substrates are measured and compared.