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Microstructural and electrochemical characterization of Ti Films deposited on steel substrates by magnetron sputtering

机译:磁控溅射沉积在钢基底上的Ti膜的组织和电化学特性

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Various techniques have been used to coat metal substrates with noble metals in order to produce corrosion-resistant materials. This paper studies the quality of titanium films deposited on AISI 4340 steel substrates by magnetron sputtering, and their corresponding corrosion behaviour. Coated specimens were characterized using microstrutural and electrochemical techniques. SEM analysis revealed that a film of columnar structure and high density was obtained when the substrate voltage and temperature were -300V and 500 deg C, respectively. For those parameters, the electrochemical potentiodynamic tests showed an improvement in the corrosion resistance of Ti-coated substrates as compared to unprotected AISI 4340 steel. For Ti-coated specimens typical current densities in range of 6 X 10~(-7) A/cm~2 and 6.3X10~(-6) A/cm~2 were measured at the potential range of 0.17 to 1.5 V. As for uncoated steel, the values were considerably higher (0.1 A/cm~2) for the same potential range, suggesting a substantial improvement in the corrosion resistance of the material. In spite of this fact, the coated material was susceptible to localized corrosion in exposed areas of the substrate, mainly as a result of substrate topography and coating quality.
机译:为了生产耐腐蚀材料,已经使用了各种技术来用贵金属涂覆金属基底。本文研究了通过磁控溅射在AISI 4340钢基底上沉积的钛膜的质量及其相应的腐蚀行为。使用微结构和电化学技术对涂层样品进行表征。 SEM分析表明,当基板电压和温度分别为-300V和500℃时,获得了柱状结构的膜和高密度。对于这些参数,电化学势能测试表明,与未保护的AISI 4340钢相比,Ti涂层基材的耐腐蚀性得到了改善。对于Ti涂层样品,在0.17至1.5 V的电位范围内测得的典型电流密度分别为6 X 10〜(-7)A / cm〜2和6.3X10〜(-6)A / cm〜2。对于未涂层的钢,在相同的电位范围内,该值要高得多(0.1 A / cm〜2),这表明材料的耐腐蚀性得到了显着提高。尽管如此,主要由于基材的形貌和涂层质量,涂层材料易于在基材的暴露区域中发生局部腐蚀。

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