首页> 外文会议>Solution synthesis of inorganic functional materials - films, nanoparticles and nanocomposites >Field Dependent Carrier Transport Mechanisms in Metal-Insulator-Metal Devices with Ba_(0.8)Sr_(0.2)TiO_3/ ZrO_2 Heterostructured Thin Films as the Dielectric
【24h】

Field Dependent Carrier Transport Mechanisms in Metal-Insulator-Metal Devices with Ba_(0.8)Sr_(0.2)TiO_3/ ZrO_2 Heterostructured Thin Films as the Dielectric

机译:Ba_(0.8)Sr_(0.2)TiO_3 / ZrO_2异质结构薄膜作为电介质的金属-绝缘体-金属器件中的场相关载流子传输机理

获取原文
获取原文并翻译 | 示例

摘要

Ba_(0.8)Sr_(0.2)TiO_3/ZrO_2 heterostructured thin films with different individual layer ZrO_2 thicknesses are deposited on Pt/Ti/SiO_2/Si substrates by a sol-gel process. The current versus voltage (Ⅰ-Ⅴ) measurements of the above multilayered thin films in metal-insulator-metal (MIM) device structures are taken in the temperature range of 310 to 410K. The electrical conduction mechanisms contributing to the leakage current at different field regions have been studied in this work. Various models are used to know the different conduction mechanisms responsible for the leakage current in these devices. It is observed that Poole-Frenkel mechanism is the dominant conduction process in the high field region with deep electron trap energy levels (φ_l) whereas space charge limited current (SCLC) mechanism is contributing to the leakage current in the medium field region with shallow electron trap levels (E_l). Also, it is seen that Ohmic conduction process is the dominant mechanism in the low field region having activation energy (E_a) for the electrons. The estimated trap level energy varies from 0.2 to 1.31 eV for deep level traps and from 0.08 to 0.18 eV for shallow level traps whereas the activation energy for electrons in ohmic conduction process varies from 0.05 to 0.17 eV with the increase of ZrO_2 sub layer thickness. An energy band diagram is given to explain the dominance of the various leakage mechanisms in different field regions for these heterostructured thin films.
机译:通过溶胶-凝胶法将具有不同单层ZrO_2厚度的Ba_(0.8)Sr_(0.2)TiO_3 / ZrO_2异质结构薄膜沉积在Pt / Ti / SiO_2 / Si衬底上。金属-绝缘体-金属(MIM)器件结构中上述多层薄膜的电流-电压(I-Ⅴ)测量是在310至410K的温度范围内进行的。在这项工作中,已经研究了有助于在不同场区域泄漏电流的导电机理。使用各种模型来了解负责这些设备中泄漏电流的不同传导机制。观察到Poole-Frenkel机理是深场电子陷阱能级(φ_1)在高场区的主导传导过程,而空间电荷限制电流(SCLC)机理对电子浅层的中场区的漏电流有贡献。陷阱水平(E_1)。此外,可以看出,欧姆传导过程是在低场区域具有电子激活能(E_a)的主要机制。对于深能级陷阱,估计的陷阱能级能量在0.2到1.31 eV之间变化,对于浅能级陷阱,估计的陷阱能级在0.08到0.18 eV之间,而随着ZrO_2子层厚度的增加,欧姆传导过程中电子的激活能在0.05到0.17 eV之间变化。给出能带图来解释这些异质结构薄膜在不同场区中各种泄漏机理的优势。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号