首页> 外文会议>Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2012 IEEE International >What''s next in robots? ∼Sensing, processing, networking toward human brain and body
【24h】

What''s next in robots? ∼Sensing, processing, networking toward human brain and body

机译:机器人的下一步是什么? 〜对人脑和身体的传感,处理,联网

获取原文
获取原文并翻译 | 示例

摘要

Most of us dreamt about robots in our childhood interacting and assisting us in our daily life. They are way beyond fiction and have emerged to become unavoidable in minimally-invasive surgery and industrial automation. There is also an explosion in research areas around autonomous cars, humanoid/android, medical, mobile remote manipulation and personal assistance robots. Such advances largely benefit from to the advances in sensing, signal processing, analog/digital circuits, and devices in semiconductor technologies that are driven by consumer and automotive electronics. Increasingly robotic platforms are also benefiting from the wirelessly connected infrastructure and the cloud computing. Expansion of such applications is going to require more human-friendly and humanlike interactive systems. Improvements in energy efficiency, dependability, security, intelligent sensor networks are among technologies, which are expected from the next generation silicon system, that provide the means to the development of the next generation interactive robots. However, more closed collaboration of the hardware/software design, integration, and data fusion are also must. Robot developers' wish list for the semiconductor industry is endless and their creativ ity is admirable.
机译:我们大多数人都梦想着在童年时代与机器人互动并在日常生活中提供帮助。它们已经超越了想象,并且在微创外科手术和工业自动化中已变得不可避免。自动驾驶汽车,类人动物/机器人,医疗,移动远程操纵和个人协助机器人等研究领域也出现了爆炸式增长。这种进步很大程度上得益于消费类和汽车电子驱动的传感技术,信号处理,模拟/数字电路以及半导体技术中的设备。越来越多的机器人平台也从无线连接的基础架构和云计算中受益。此类应用程序的扩展将需要更人性化和人性化的交互式系统。能源效率,可靠性,安全性,智能传感器网络的改进是下一代芯片系统所期望的技术之一,这些技术为开发下一代交互式机器人提供了手段。但是,还必须在硬件/软件设计,集成和数据融合方面进行更紧密的协作。机器人开发人员对半导体行业的愿望清单很多,他们的创造力令人钦佩。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号