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Signal integrity analysis of carbon-based on-chip nano-interconnects

机译:碳基片上纳米互连的信号完整性分析

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The paper investigates the Signal Integrity performance of innovative on-chip interconnects made by carbon-based materials, such as Carbon Nanotubes (CNTs) and Graphene NanoRibbons (GNRs). The innovative solutions are compared to the conventional copper realization. A simple but physically meaningful equivalent circuital model is presented for these interconnects, which properly accounts for the quantistic and kinetic phenomena observed at nanoscale. The models also include effects of interconnect size and temperature. Using this model, a Signal Integrity analysis of the electrical performance of global level on-chip interconnects is carried out, referring to the 22nm technology node.
机译:本文研究了由碳纳米材料(例如碳纳米管(CNT)和石墨烯纳米带(GNR))制成的创新的片上互连的信号完整性性能。将创新的解决方案与传统的铜实现方案进行了比较。为这些互连线提供了一个简单但在物理上有意义的等效电路模型,该模型正确地说明了在纳米级观察到的定量和动力学现象。这些模型还包括互连尺寸和温度的影响。使用该模型,参考22nm技术节点,对全局级片上互连的电性能进行了信号完整性分析。

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