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PULSE PLATING OF HIGH MOMENT CoFe THIN FILMS

机译:高速CoFe薄膜的脉冲镀

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摘要

The electrodeposition of iron-rich, FeCo-based alloys was explored using current modulation techniques. By utilizing atomic-layer electrodeposition (ALE), shinny Fe_(65-70)Co_(30-35) films with 2.3 to 2.4-Tesla was obtained without any additives. The deposit has bcc structures with preferred orientations of (110) and little amounts of (211) planes. No (211) planes were observed in the films with B_s of 2.3 to 2.4-Tesla. Saturation moment of ALEed FeCo films can be controlled by iron contents, in agreement with Bozorth's diagram. Enhanced hydrogen evolution reaction (HER) associated with low-pH plating seems to facilitate monolayer deposition - a Hydrogen-assisted ALE mechanism being proposed. Film stress was found to be HER-related, regardless of iron contents. Stress build-up during ALE can be interrupted by laminating nano-oxide layers in the deposit through a conditional pulse reversal scheme. High throwing power was also observed with this novel approach.
机译:使用电流调制技术探索了富铁,FeCo基合金的电沉积。通过使用原子层电沉积(ALE),无需添加任何添加剂即可获得具有2.3至2.4特斯拉的光亮Fe_(65-70)Co_(30-35)薄膜。该沉积物具有优选方向为(110)和少量(211)平面的bcc结构。在B_s为2.3至2.4-特斯拉的薄膜中未观察到(211)平面。 ALEed FeCo膜的饱和力矩可以通过铁含量控制,与Bozorth的图一致。与低pH电镀相关的增强的析氢反应(HER)似乎促进了单层沉积-提出了氢辅助ALE机理。发现膜应力与HER有关,与铁含量无关。通过有条件的脉冲反转方案,可以通过在沉积物中层压纳米氧化物层来中断ALE期间的应力积累。通过这种新颖的方法还观察到了高投掷力。

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