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Regulation of the forming process and the set voltage distribution of unipolar resistance switching in spin-coated CoFe2O4 thin films

机译:旋涂CoFe2O4薄膜的形成过程和单极电阻切换的设定电压分布的调节

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摘要

We report the preparation of (111) preferentially oriented CoFe2O4 thin films on Pt(111)/TiO2/SiO2/Si substrates using a spin-coating process. The post-annealing conditions and film thickness were varied for cobalt ferrite (CFO) thin films, and Pt/CFO/Pt structures were prepared to investigate the resistance switching behaviors. Our results showed that resistance switching without a forming process is preferred to obtain less fluctuation in the set voltage, which can be regulated directly from the preparation conditions of the CFO thin films. Therefore, instead of thicker film, CFO thin films deposited by two times spin-coating with a thickness about 100 nm gave stable resistance switching with the most stable set voltage. Since the forming process and the large variation in set voltage have been considered as serious obstacles for the practical application of resistance switching for non-volatile memory devices, our results could provide meaningful insights in improving the performance of ferrite material-based resistance switching memory devices.
机译:我们报告使用旋涂工艺在Pt(111)/ TiO2 / SiO2 / Si衬底上制备(111)优先取向的CoFe2O4薄膜。对于钴铁氧体(CFO)薄膜,改变了退火后的条件和膜厚,并准备了Pt / CFO / Pt结构来研究电阻切换行为。我们的结果表明,不采用成形工艺的电阻切换对于获得较小的设定电压波动较为可取,该波动可直接由CFO薄膜的制备条件进行调节。因此,通过两次旋涂沉积的CFO薄膜厚度约为100nm,而不是更厚的膜,可以在最稳定的设定电压下实现稳定的电阻切换。由于形成过程和设定电压的大变化被认为是非易失性存储器件电阻切换的实际应用的严重障碍,因此我们的结果可为提高基于铁氧体材料的电阻切换存储器件的性能提供有意义的见解。 。

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