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EVALUATION OF 200 MM MPTI FLOATING HEAD WITH VARIED CONSUMABLES

机译:各种耗材的200 MM MPTI浮头的评估

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摘要

A high performance polishing is essential to improve the yield and wafer edge exclusion for the Chemical Mechanical Planarization (CMP) processes, especially for the next generation devices. This study is to evaluate the floating head oxide and BPSG CMP performance with varied consumables. The results demonstrate the excellent process performance of this floating head technology that are comparable to or even exceed those from commercial available polish carriers.
机译:高性能抛光对于提高化学机械平坦化(CMP)工艺(尤其是下一代器件)的良率和晶圆边缘排除率至关重要。这项研究旨在评估各种消耗品的浮头氧化物和BPSG CMP性能。结果表明,这种浮头技术具有出色的工艺性能,可与甚至超过市售抛光载体的工艺性能媲美。

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