CMP System Using Fixed Abrasive (FX-CMP) for Dielectric Planarization

摘要

We have developed a novel planarization process (called FX-CMP, especially effective for shallow trench isolation (STI)) that can provide high planarity at a practical removal rate when using a fixed abrasive tool (FA tool) like a grindstone for dielectric planarization. To obtain practical performance in terms of defect level, removal rate, non-uniformity, and stability, a new dressing unit for the FX-CMP system was developed. The performance of the dressing unit, which can control the height of a diamond dresser (CH dresser), was evaluated. Accordingly, it was found that the FX-CMP system with the CH dresser produces a low defect level, a long FA tool life, and a stable removal rate.