首页> 外文会议>Sensors Expo, May 9-11, 2000, Anaheim, California >A three-level high fill-factor uncooled infrared microbolometer focal plane array
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A three-level high fill-factor uncooled infrared microbolometer focal plane array

机译:三级高填充系数非制冷红外微辐射热计焦平面阵列

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We have developed a three-level microbolometer uncooled infrared FPA(Focal Plane Array). The proposed structure features that the supporting arms structure is separated from the bridge structure using double sacrificial layers and thus, the optical fill-factor of the infrared detector increases effectively and the thermal isolation is maximized. Through several structural designs and tests, we have obtained an optimized three-level detector structure having a 92% optical fill-factor and fabricated a 256x256 microbolometer FPA. The performance of the proposed detector shows that it performs well as an effective electro-thermal structure for the highly integrated FPA.
机译:我们已经开发了一种三级微测辐射热计非制冷红外FPA(焦平面阵列)。所提出的结构的特征在于,利用双牺牲层将支撑臂结构与桥结构分开,因此,红外检测器的光学填充率有效增加,并且热隔离最大化。通过几次结构设计和测试,我们获得了具有92%光学填充因子的优化三级检测器结构,并制造了256x256微型测辐射热器FPA。所提出的检测器的性能表明,对于高度集成的FPA,它作为有效的电热结构表现良好。

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