首页> 外文会议>Sensor+Test 2008 Proceedings >Uncooled Amorphous Silicon TEC-less 1/4 VGA IRFPA with 25 m Pixel-Pitch for Low-End Applications
【24h】

Uncooled Amorphous Silicon TEC-less 1/4 VGA IRFPA with 25 m Pixel-Pitch for Low-End Applications

机译:非冷却,无硅,无TEC的无硅1/4 VGA IRFPA,具有25 m像素间距,适用于低端应用

获取原文
获取原文并翻译 | 示例

摘要

The high level of accumulated expertise by ULIS and CEA/LETI on uncooled microbolometers made from an amorphous silicon layer enables ULIS to develop 384 × 288 (1/4 VGA) IRFPA format with 25 urn pixel-pitch designed for low end application. This detector has kept all the innovations developed on the full TV format ROIC (detector configuration by serial link, low power consumption or wide electrical dynamic range ...). The specific appeal of this unit lies in the miniaturization of the TEC-less (Thermo-Electric Cooler) package and its extremely light weight. The reduction of the pixel-pitch and the innovative package turn this array into a low cost product well adapted for mass production.
机译:ULIS和CEA / LETI在由非晶硅层制成的非制冷测微计上积累了很高的专业知识,使ULIS能够开发384×288(1/4 VGA)IRFPA格式的25像素像素间距的低端应用。该探测器保留了在完整电视格式ROIC上开发的所有创新(通过串行链接配置探测器,低功耗或宽动态范围...)。该单元的特别吸引力在于无TEC封装(热电冷却器)的小型化和极轻的重量。像素间距的减少和创新的封装使该阵列成为非常适合大规模生产的低成本产品。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号