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TIME-TEMPERATURE INDICATOR FOR EVALUATING INCIPIENT THERMAL DAMAGE OF CFRP

机译:评估CFRP初始热损伤的时间温度指标

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摘要

Incipient thermal damage is a significant issue for CFRP composites because it is difficult torndetect by common NDE techniques like ultrasound and it can cause fiber-matrix debonding,rndelamination, and matrix embrittlement which can reduce the mechanical properties of therncomposite. Diffuse reflectance infrared transform spectroscopy (DRIFTS) is capable ofrndetecting incipient damage, but it has a small spot size that is not efficient for inspecting largernareas for thermal damage. In our previous work a thermally activated fluorescent probe wasrnshown to activate when the composite was thermally exposed. This “turn-on” type behaviorrncould show that thermal exposure had occurred, but could not provide more details about thernthermal event. In this study a method for estimating the time and temperature of the thermalrnexposure (a so-called time-temperature indicator or TTI) is presented. The basis for this methodrnis combining two different thermally activated probes with different activation kinetics andrnemission wavelengths. Using ratiometric fluorescence to monitor the changes in the fluorescencernspectra, time-temperature response curves can be generated that can be used for estimating therntime and temperature of the thermal exposure.
机译:初始热损伤对于CFRP复合材料来说是一个重要的问题,因为它很难通过普通的NDE技术(如超声)进行破损检测,并且可能引起纤维基质剥离,熔覆和基体脆化,从而降低复合材料的机械性能。漫反射红外变换光谱(DRIFTS)能够检测初期损坏,但其光斑尺寸较小,无法有效地检查较大的区域是否存在热损坏。在我们以前的工作中,显示了热激活的荧光探针在复合材料被热暴露时可以激活。这种“开启”类型的行为可能表明发生了热暴露,但无法提供有关热事件的更多详细信息。在这项研究中,提出了一种估计热暴露时间和温度的方法(所谓的时间-温度指示器或TTI)。该方法的基础是将两个具有不同激活动力学和发射波长的不同热激活探针结合在一起。使用比率荧光监测荧光光谱的变化,可以生成时间-温度响应曲线,该曲线可用于估算热暴露的时间和温度。

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  • 来源
  • 会议地点 Seattle WA(US)
  • 作者单位

    University of Washington, Materials Science and Engineering, Seattle, WA, 98195;

    University of Washington, Materials Science and Engineering, Seattle, WA, 98195;

    University of Washington, Materials Science and Engineering, Seattle, WA, 98195;

    University of Washington, Materials Science and Engineering, Seattle, WA, 98195;

    University of Washington, Materials Science and Engineering, Seattle, WA, 98195;

    The Boeing Company, Seattle, WA1;

    University of Washington, Materials Science and Engineering, Seattle, WA, 98195;

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