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CARRIER LIFETIME MEASUREMENTS BY MICROWAVE PHOTO-CONDUCTIVITY DECAY METHOD

机译:微波光电导衰减法测量载体寿命

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摘要

The recombination lifetimes of silicon wafers were studied using microwave photo-conductivity decay( μ PCD) method with variable photo-injection function. For samples with surface inversion layers, the lifetimes increased as the injected carrier concentration decreased, and converged toward the value determined by the SiO_2/Si interface trap density. It was found that the bulk recombination lifetimes could be measured in middle-high injection. Any clear dependence was not observed in the samples with surface accumulation layers. The recombination lifetimes of light-irradiated p-type silicon with iron contamination revealed strong dependence on injected carrier concentration due to breaking up iron-boron pairs. Molybdenum contamination of the epitaxial layers in p/p+ and p/p- wafers were also investigated using the differential μ PCD technique.
机译:利用具有可变光注入功能的微波光导衰减(μPCD)方法研究了硅晶片的复合寿命。对于具有表面反转层的样品,寿命随着注入的载流子浓度的降低而增加,并趋于由SiO_2 / Si界面陷阱密度确定的值。发现可以在中高注射量下测量整体重组寿命。在具有表面累积层的样品中未观察到任何明显的依赖性。带有铁污染的光辐照p型硅的复合寿命表明,由于铁-硼对的断裂,其对注入的载流子浓度的依赖性很大。还使用差分μPCD技术研究了p / p +和p / p-晶圆中外延层的钼污染。

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