首页> 外文会议>Radio Frequency Integrated Circuits Symposium (RFIC), 2012 IEEE >A 70–100GHz direct-conversion transmitter and receiver phased array chipset in 0.18µm SiGe BiCMOS technology
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A 70–100GHz direct-conversion transmitter and receiver phased array chipset in 0.18µm SiGe BiCMOS technology

机译:采用0.18µm SiGe BiCMOS技术的70–100GHz直接转换发射器和接收器相控阵芯片组

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This paper presents a transmitter and receiver phased array chipset fabricated in a 0.18µm SiGe BiCMOS process with ƒT / ƒMAX of 240/270GHz. Each chip comprises four phased array elements with distributed calibration memory and calibrated direct up and down-conversion mixer chain. Both transmitter and receiver arrays operate from 1.5V and 2.5V power supplies and consume 1W each. Each receive channel has a conversion gain of 33 dB and noise figure of < 7dB from 75–95GHz. Each transmit channel has a flat saturated output power of > 5dBm between 70 and 100GHz. The use of the transmitter for highly spectral efficient datacom applications is demonstrated using a 256-QAM signal with 3% EVM and 0dBm output power for each channel at 90GHz.
机译:本文介绍了采用0.18µm SiGe BiCMOS工艺制造的发射器和接收器相控阵芯片组,其ƒT/ƒMAX为240 / 270GHz。每个芯片包括四个相控阵元件,这些元件具有分布式校准存储器和校准后的直接上,下转换混频器链。发送器和接收器阵列均采用1.5V和2.5V电源供电,每个功耗均为1W。每个接收通道在75–95GHz范围内具有33 dB的转换增益和<7dB的噪声系数。每个发射通道在70至100GHz之间具有大于5dBm的平坦饱和输出功率。通过在90GHz的每个通道使用256-QAM信号,3%EVM和0dBm输出功率,证明了该发射机在高频谱效率数据通信应用中的使用。

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