Device and electromagnetic co-simulation of TSV: Substrate noise study and compact modeling of a TSV in a matrix

摘要

This paper presents the results obtained from the simulation of TSV structures in face-to-back stacked dice. A novel simulation tool enabling device and electromagnetic (EM) co-simulation is used. We introduce a method to extract, from S-parameter simulation, a physics-based compact model of the TSV in a matrix and study the impact of layout variations on the TSV equivalent electrical model.