Reliability Analysis of PBGA Electronic Package Under Sinusoidal Vibration Loading

摘要

In order to research the sinusoidal vibration reliability of plastic ball grid array (PBGA) solder joints, sinusoidal vibration tests on PBGA specimens were designed. The specimens were subjected to three kinds of different vibration excitations around the 1st natural frequency during the tests. Because the size of solder joint is too small to measure the stress directly, the resistances of solder joints were monitored in real time to obtain the failure time of the electronic components. Two-parameter Weibull distribution model was used to analyze the test results, metallurgical cross-sections analysis was conducted on the failed solder joints to identify the failure modes and mechanisms. In the paper, finite element analysis was implemented to obtain the stress of solder joints by the software ABAQUS, the finite element model was then used to obtain the specimens' weight, natural frequency and acceleration amplitude, and the results were compared to experimental values to ensure the accuracy of the finite element model. Finally the results of the vibration tests and finite element analysis were combined to create S-N curve of the solder joints under vibration conditions.