Wafer bonding for MEMS

摘要

Intelligent microsystems used in broad range of applications require a higher and higher level of integration. Electronics has to be integrated with different micromechanical sensor components, mechanical, optical and fluidic elements forming for instance a biochemical sensor. Such integration involves many different materials with their specific characteristics. Thus, the understanding of the different wafer bonding mechanisms and their application areas is essential to build innovative and commercial devices. An overview of various wafer bonding technologies used in MST are presented and illustrated with examples.