MECHANICAL RELIABILITY OF DIRECTLY BONDED SILICON MEMS COMPONENTS

摘要

During use, directly wafer-bonded devices such as acceleration sensors, gyroscopes, micropumps, or microvalves are exposed to continuously or periodically acting mechanical stresses particularly due to vibration, thermo-mechanical mismatch, or internal and external pressures. For theses kind of applications a proven strength and long-term reliability is required. It will be shown in that paper that fracture mechanical approaches can be applied for strength and lifetime analyses of wafer-bonded devices. These approaches consider the influence of bonding defects, micro-machined structures in the bonded interface, the fracture mechanical properties of the interface as well as the loading situation.