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Dielectric behavior and film surface structure in fluorinated aromatic polyimide films

机译:氟化芳族聚酰亚胺薄膜的介电行为和薄膜表面结构

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摘要

Two series of fluorinated aromatic polyimides were developed as novel dielectric packing materials with potential applications in microelectronics. These polyimides were synthesized based on diamines or dianhydrides containing (trifluoromethyl)phenyl groups at the 2- and 2'-positions of biphenyl units. Powder samples displayed excellent solubility in common organic solvents, and film samples were tough, flexible, transparent and thermally stable with low permittivities, moderately low CTEs, and high T_gs. These polyimides exhibited multiple relaxations in dynamic mechanical and dielectric analysis. The optical birefringence and the dielectric relaxation anisotropy characterized the structural in-plane orientation within these amorphous polyimide films.
机译:开发了两个系列的氟化芳族聚酰亚胺作为新型介电包装材料,在微电子领域具有潜在的应用。这些聚酰亚胺是基于在联苯单元的2-和2'-位含有(三氟甲基)苯基的二胺或二酐合成的。粉末样品在普通有机溶剂中显示出优异的溶解性,薄膜样品坚韧,柔软,透明,热稳定,介电常数低,CTE适度低,T_gs高。这些聚酰亚胺在动态力学和介电分析中表现出多重弛豫。光学双折射和介电弛豫各向异性表征了这些非晶聚酰亚胺膜内的结构面内取向。

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