Predictable reflow using solid solder deposition technology

摘要

Attaching surface mount devices (SMDs) to printed ciruits is a challenge that generates a lot of debate as to what methods work for which users at any given time during the lifetime of a product. There are many methods used to place and fuse SMD components to one or both sides of a printed circuit board. Most conentrate on the high volume through put needed once the product has been protyped and tested at the development level. But w hat about the methods used to assemble prototype quantities, usually in the lab or at small contract manufacturers specializing in small runs. Solid Solder Deposit (SSD) is emerging as a reliable s olution to many of the challenges facing this segment of the cycle often overlooked.