Reflow Soldering and Isothermal Solid-State Aging of Sn-Ag Eutectic Solder on Au/Ni Surface Finish

C.M. Liu; C.E. Ho; W.T. Chen

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Reflow Soldering and Isothermal Solid-State Aging of Sn-Ag Eutectic Solder on Au/Ni Surface Finish

机译：Au / Ni表面处理的Sn-Ag共晶焊料的回流焊和等温固态时效

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摘要

The reaction between the eutectic Sn-3.5Ag solder and the Au/Ni surface finish during reflow as well as during isothermal aging was studied.

机译：研究了回流过程中以及等温时效过程中共晶Sn-3.5Ag焊料与Au / Ni表面光洁度之间的反应。

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《Journal of Electronic Materials》 |2001年第9期|共5页
作者
C.M. Liu; C.E. Ho; W.T. Chen;
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正文语种 eng
中图分类材料;
关键词
surface finish; Sn-Ag solders; lead-free solders; reflow;

机译：表面处理;Sn-Ag焊料;无铅焊料;回流;

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1. 液态时效条件下Zn元素的添加对共晶Sn-58Bi焊料力学性能的影响 [J] . 马东亮, 吴萍中国有色金属学报（英文版） . 2015,第004期
2. 液态时效条件下Zn元素的添加对共晶Sn-58Bi焊料力学性能的影响（英文） [J] . 马东亮, 吴萍中国有色金属学报：英文版 . 2015,第004期
3. Reflow Soldering and Isothermal Solid-State Aging of Sn-Ag Eutectic Solder on Au/Ni Surface Finish [J] . C.M. Liu, C.E. Ho, W.T. Chen Journal of Electronic Materials . 2001,第9期

机译：Au / Ni表面处理的Sn-Ag共晶焊料的回流焊和等温固态时效
4. Effect of Isothermal Aging on the Long-Term Reliability of Fine-Pitch Sn-Ag-Cu and Sn-Ag Solder Interconnects With and Without Board-Side Ni Surface Finish [J] . Lee Tae-Kyu, Duh Jeng-Gong Journal of Electronic Materials . 2014,第11期

机译：等温时效对带有和不带有板侧镍表面处理的细间距Sn-Ag-Cu和Sn-Ag焊料互连的长期可靠性的影响
5. Interfacial reactions of Sn-Cu solder with Ni/Au surface finish on Cu pad during reflow and aging in ball grid array packages [J] . M.N. Islam, Y.C. Chan Materials Science and Engineering. B, Solid-State Materials for Advanced Technology . 2005,第3期

机译：球栅阵列封装中的回流和时效过程中，锡垫上具有Ni / Au表面光洁度的Sn-Cu焊料的界面反应
6. Intermetallic Compound Formation in Sn-Co-Cu, Sn-Ag-Cu and Eutectic Sn-Cu Solder Joints on Electroless Ni(P) Immersion Au Surface Finish After Reflow Soldering [C] . Peng Sun, Cristina Andersson, Xicheng Wei, Conference on High Density Microsystem Design and Packaging and Component Failure Analysis . 2006

机译：在回流焊接后，在Sn-Co-Cu，Sn-Ag-Cu和共晶Sn-Cu焊点中的金属间化合物形成在化学镜（P）浸没Au表面饰面
7. Microstructural changes under isothermal aging and their influence on thermal fatigue reliability for tin-lead and lead-free solder joints, including microstructural changes under isothermal aging in mixed solder joints [D] . Choubey, Anupam 2007

机译：锡铅和无铅焊点在等温老化下的微观结构变化及其对热疲劳可靠性的影响，包括混合焊点在等温老化下的微观结构变化
8. Suppressed Growth of (Fe Cr Co Ni Cu)Sn2 Intermetallic Compound at Interface between Sn-3.0Ag-0.5Cu Solder and FeCoNiCrCu0.5 Substrate during Solid-state Aging [O] . Yu-An Shen, Chun-Ming Lin, Jiahui Li, -1

机译：固态时效期间Sn-3.0Ag-0.5Cu焊料与FeCoNiCrCu0.5衬底之间的界面处（FeCrCoNiCu）Sn2金属间化合物的生长受到抑制
9. Cross-interaction of interfacial reactions in Ni (Au/Ni/Cu)-SnAg-Cu solder joints during reflow soldering and thermal aging [O] . Chen Hongtao, Wang Chunqing, Yan Cheng, 2007

机译：Ni（Au / Ni / Cu）-SnAg-Cu焊点中的界面反应在回流焊接和热时效过程中的交互作用

Reflow Soldering and Isothermal Solid-State Aging of Sn-Ag Eutectic Solder on Au/Ni Surface Finish

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