Suitability of Thermoplastic Base Materials for PCB's

摘要

Suitability of Thermoplastic Base Materials for PCB's The feasibility of metallization and structuring of thermoplastic materials opens a new interesting market with great potential : the 3-dimensional Molded Interconnect Devices (3D - MID). MIDs are 3-dimensional molded circuit carriers made of thermoplastics. This production innovation integrates electrical and mechanical functions on any spatially formed circuit carrier and can offer enormous advantages in comparison to conventional solutions in electronic production. But the use of thermoplastics also makes new requirements on the assembly of circuit boards, and the electrical, thermal and mechanical properties of various thermoplastic materials differ from epoxy resins. In the following paper, the results of different research projects are presented to evaluate the suitability of thermoplastics as a base material for circuit boards.