Design re-use: where is the productivity going to come from?

摘要

Semiconductor process geometries are shrinking and the availablesilicon capacity is growing at an amazing pace. Consumerization andconvergence applications are causing tremendous time to marketpressures, resulting in increased product complexity and reduced designcycle times. The gap between what can be built (silicon capacity) andwhat can be designed is widening. This `design productivity gap' iscausing an industry-wide shift to system-on-a-chip (SOC) designmethodology. The corner-stone for success of the SOC methodology isdesign re-use. The methodology for design re-use will evolve goingforward. Huge investments will be made to setup infrastructure andmethodologies for creation of re-usable designs and their integrationinto future products. But, will they deliver the expected productivitygains? This talk presents a progression of re-use methodologyalternatives and the key characteristics and productivity impact of eachapproach