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Improvement of the defect level of micro-computer LSI testing

机译:提高微机LSI测试的缺陷水平

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The most important points concerning the manufacturing test of VLSI are (1) High quality testing, (2) Low cost testing procedures and (3) Fast development. However, together with the high integration of VLSI,recent large-scale, multifunctional and complex technology has made the above test procedures more and more difficult to secure. Especially in regard to measurement quality, where stable measurement is performed at the factory, and the testing results quality, which prevents no good devices from being shipped once test is completed, the actual level of technology does not provide a complete solution for the initial stage of the introduction at the factory even through the implementation of a large number of procedures.rnThis paper will study the reduction in the defect level in order to improve the quality of micro processors through the addition of new methods ("flag check" and "address check") to the conventional Single Stuck-at Fault verification.
机译:有关VLSI制造测试的最重要的一点是(1)高质量测试,(2)低成本测试程序,以及(3)快速开发。但是,随着超大规模集成电路的高度集成,最近大规模,多功能和复杂的技术使得上述测试程序越来越难以保证。尤其是在测量质量方面(在工厂中进行稳定的测量),以及测试结果质量(一旦完成测试就阻止了好的设备的交付),实际的技术水平并未为初始阶段提供完整的解决方案即使通过执行大量程序,也可以在工厂中进行介绍。rn本文将研究缺陷水平的降低,以便通过添加新方法(“标志检查”和“地址”)来提高微处理器的质量。检查”),以进行传统的单卡住故障验证。

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