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Fiber Bragg-Grating Sensors for SHM and FEM of In-Service Bonded Multi-Material Pi-joints

机译:用于在役粘合多材料Pi接头的SHM和FEM的光纤布拉格光栅传感器

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Prediction of the performance and the failure initiation in in-service adhesivelyrnbonded multi-material Pi-joints is of special interest for determining the maximumrnload carrying capacity and structural integrity of resulting components for marine,rnautomotive and aerospace applications. Currently fiber Bragg-grating (FBG) sensorsrnare being increasingly used to monitor the bonded region in adhesive joints as they dornnot affect the intrinsic bonding properties. This paper presents experimental andrnnumerical study on in-service multi-material Pi-joints using strategically embeddedrnFBG sensors. In-house manufactured Pi-joints consisted of various combinations ofrnAluminum, Steel and Glass Fiber Reinforced Polymer (GFRP) as adherends and usedrnFM-94K adhesive provided by Cytec as the structural adhesive. Apart from intact Pijoints,rnPi-joints with the manufacturing defect were also manufactured. Initially, FiniternElement Modeling (FEM) was used to predict the behavior of Pi-joints with similarrnand dissimilar adherends under varying load conditions. Afterwards, FBG sensorsrnwere strategically placed in the regions of interest to monitor the strains during thernlongitudinal and transversal static loading of Pi-joints. A novel method for externalrnFBG embedding was proposed and validated using strain gages. Proposed methodrnallows easy remove and reuse of the FBG sensor. Strains measurements acquired byrnFBG sensors were validated by strains measurements obtained using strain gages.rnExperimental data from the embedded FBGs is further used to develop experimentallyrnvalidated simulations (EVS) which in turn can be used as a design tool for multimaterialrnPi-joints. Preliminary results demonstrate potential of the developedrntechnique to predict the strain behavior and evaluate the performance of bonded Pijointsrnwith similar and dissimilar adherends.
机译:对于确定用于海上,汽车和航空航天应用的最终组件的最大承载能力和结构完整性,使用中的粘合式多材料Pi接头的性能和失效引发的预测特别有意义。目前,光纤布拉格光栅(FBG)传感器越来越多地用于监视粘合剂接头中的粘合区域,因为它们不影响固有的粘合性能。本文提出了使用策略性嵌入式FBG传感器对在役多材料Pi接头进行实验和数值研究。内部制造的Pi接头包括铝,钢和玻璃纤维增​​强聚合物(GFRP)作为被粘物的多种组合,并使用Cytec提供的FM-94K粘合剂作为结构粘合剂。除了完整的Pijoints,还制造了具有制造缺陷的rnPi关节。最初,FiniternElement Modeling(FEM)用于预测在变化的载荷条件下具有相似和不相似被粘物的Pi接头的行为。之后,将FBG传感器策略性地放置在目标区域中,以监测Pi接头的纵向和横向静态载荷期间的应变。提出了一种新的外部FBG嵌入方法,并使用应变计对其进行了验证。提出的方法使FBG传感器易于拆卸和重复使用。由FBG传感器获取的应变测量值通过使用应变计获得的应变测量值进行了验证。来自嵌入式FBG的实验数据被进一步用于开发经过实验验证的仿真(EVS),而该仿真又可以用作多材料πPi接头的设计工具。初步结果表明,开发的技术可以预测应变行为并评估具有相似和不相似被粘物的粘结Pijointsrn的性能。

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