首页> 外文会议>American Society for Composites technical conference >Fiber Bragg-Grating Sensors for SHM and FEM of In-Service Bonded Multi-Material Pi-joints
【24h】

Fiber Bragg-Grating Sensors for SHM and FEM of In-Service Bonded Multi-Material Pi-joints

机译:用于SHM和FEM的纤维布拉格光栅传感器,用于在役粘合多材料PI-Chects

获取原文

摘要

Prediction of the performance and the failure initiation in in-service adhesively bonded multi-material Pi-joints is of special interest for determining the maximum load carrying capacity and structural integrity of resulting components for marine, automotive and aerospace applications. Currently fiber Bragg-grating (FBG) sensors are being increasingly used to monitor the bonded region in adhesive joints as they do not affect the intrinsic bonding properties. This paper presents experimental and numerical study on in-service multi-material Pi-joints using strategically embedded FBG sensors. In-house manufactured Pi-joints consisted of various combinations of Aluminum, Steel and Glass Fiber Reinforced Polymer (GFRP) as adherends and used FM-94K adhesive provided by Cytec as the structural adhesive. Apart from intact Pijoints, Pi-joints with the manufacturing defect were also manufactured. Initially, Finite Element Modeling (FEM) was used to predict the behavior of Pi-joints with similar and dissimilar adherends under varying load conditions. Afterwards, FBG sensors were strategically placed in the regions of interest to monitor the strains during the longitudinal and transversal static loading of Pi-joints. A novel method for external FBG embedding was proposed and validated using strain gages. Proposed method allows easy remove and reuse of the FBG sensor. Strains measurements acquired by FBG sensors were validated by strains measurements obtained using strain gages. Experimental data from the embedded FBGs is further used to develop experimentally validated simulations (EVS) which in turn can be used as a design tool for multimaterial Pi-joints. Preliminary results demonstrate potential of the developed technique to predict the strain behavior and evaluate the performance of bonded Pijoints with similar and dissimilar adherends.
机译:在役粘合的多材料PI接头中的性能和失效启动的预测对于确定用于船舶,汽车和航空航天应用的所得组件的最大载荷能力和结构完整性的特殊兴趣。目前纤维布拉格 - 光栅(FBG)传感器越来越多地用于监测粘合剂接头中的粘合区域,因为它们不影响内在粘合性能。本文介绍了使用策略性嵌入式FBG传感器在役多材料PI接头的实验性和数值研究。内部制造的PI接头包括铝,钢和玻璃纤维增​​强聚合物(GFRP)的各种组合,用Cytec提供的Cytec提供的FM-94K粘合剂作为结构粘合剂。除了完整的PIJOINTS之外,还制造了具有制造缺陷的PI接头。最初,使用有限元建模(FEM)来预测在不同负载条件下具有相似和异种粘物的PI接头的行为。然后,FBG传感器在纵向和横向静态载荷期间策略性地放置在感兴趣的区域中,以监测PI-关节的纵向和横向静态载荷。提出了一种新的外部FBG嵌入方法,并使用应变计验证。所提出的方法允许轻松地移除和重用FBG传感器。通过使用应变计获得的菌株测量来验证由FBG传感器获得的菌株测量。来自嵌入式FBG的实验数据还用于开发实验验证的模拟(EVS),这又可以用作多维PI-Chects的设计工具。初步结果证明了开发技术预测应变行为的潜力,并评估与相似且不同的粘附性的粘合PIJOINTS的性能。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号