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Enhancing the contact interface by matching the surface pressure and current density distribution

机译:通过匹配表面压力和电流密度分布来增强接触界面

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摘要

This article focuses on the differences in how the contact interface surface normal load and Current Density (J) are distributed across a 'Hertzian style' electrical contact interface. Structuring the contact interface in a way that the a-spots carrying the greatest load coincide with the outer perimeter contact a-spots with the greatest current density will lead to lower Contact Resistance (RC) Sn contacts. This effect is not as pronounced with more noble finishes.
机译:本文重点介绍跨“赫兹式”电接触界面的接触界面表面法向载荷和电流密度(J)的差异。以最大负载的a点与最大电流密度的外周接触a点重合的方式构造接触界面,将导致较低的接触电阻(RC)Sn接触。这种效果在高贵的饰面中不那么明显。

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