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Characterization of Intermetallic Compounds in Al-Ag Bimetallic Interfaces

机译:Al-Ag双金属界面中金属间化合物的表征

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In electrical power engineering, silver coatings on conductor materials are commonly used for better contact behavior and to allow higher temperatures at joints. It is known, that Al-Ag bimetal joints are not long-term stable. The system Al-Ag forms two intermetallic compounds (IMC) at temperatures below 300 deg C and usually these intermetallic compounds resulting from interdiffusion processes have worse electrical and mechanical properties compared to the pure metals (e.g. higher resistivity, high brittleness). Phase pure samples of the IMC (Ag3Al and Ag2Al) have been prepared and electrically characterized. The results show, that the resistivity is much higher than for pure Al or Ag. It was also found, that for Al-Ag bimetal interfaces being exposed to air, a reaction with oxygen takes place which reduces or even stops the growth of intermetallic compounds.
机译:在电力工程中,通常在导体材料上使用银涂层,以获得更好的接触性能并允许接头处具有更高的温度。众所周知,Al-Ag双金属接头不是长期稳定的。 Al-Ag系统在低于300摄氏度的温度下会形成两种金属间化合物(IMC),与纯金属相比,这些相互扩散过程产生的金属间化合物通常具有较差的电气和机械性能(例如,较高的电阻率,高脆性)。已经制备了IMC的纯相样品(Ag3Al和Ag2Al)并进行了电学表征。结果表明,电阻率远高于纯Al或Ag。还发现,对于暴露于空气的Al-Ag双金属界面,发生与氧气的反应,这减少或什至停止了金属间化合物的生长。

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