A study on thermal property of TQFP-100L package via DOE method

摘要

Though Thin-Quad-Flat-Package (TQFP) was developed for years, it is now widely adapted for packaging IC products. For broadening its application to IC product, detail evaluation of the thermal property that is strongly depending on the package structure and the involved materials is necessary. For facilitating product design, this study employs an economic statistical method, DOE, to study the effect of lead frame design, encapsulation compound and mechanical dimensions to the thermal resistance of the package via results from the CAE modeling and the verification experiments. In addition, the influence of application, such as PCB substrate and environment, is included in the analysis as taking customer requirement into consideration.