The stress field of multilayer structure in electronic packaging

摘要

A model of calculating the interfacial thermal stresses of multilayer structure is established by taking into account the effect of adhesive layers. The variation of interfacial thermal stresses with the thickness of adhesive layer is analyzed. The results show that the stress concentration exists near the free edge. The interfacial peeling stress can not be neglected although it is smaller than the interfacial shear stress. In addition, the thickness of adhesive layer has an important influence on the interfacial thermal stress concentration.