Crack propagation in multilayer thin-film structures of electronic packages using the peridynamic theory

摘要

This paper presents an application of the peridynamic theory to predict crack paths in multilayer thinfilm structures of electronic packages. The peridynamic theory is a nonlocal continuum theory that has an inherent crack initiation and growth criterion. Specifically, the peridynamic theory is employed to model cross-sectional nanoindentation, an experimental technique used for characterizing interfacial adhesion and observing crack paths. Cross-sectional indentation experiments previously conducted on blanket and patterned thin-film structures were simulated. The predicted crack propagation paths in both blanket and patterned multilayer thin-film structures compare well with the results from cross-sectional nanoindentation experiments.