Reflow/encapsulants epoxy formulations with soldering properties

摘要

Electronic interconnection technology of the next century will be influenced by two mainstreams: 1) Technically and economically, we will be forced to use more flip-chip technology and chip-size packaging (CSP) components. The samller and smaller solder joints will be no longer able to withstand the chemical requirements of the electronic interconnect. This is because of the thermal mismatch between the chip or chip-size packaging component and the substrate. 2) Promoted by environmental concerns and not by technical requirements, lead free solder alloys show until now less mechanical reliability compared to the well known lead containing soft solders.