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A simple method to design the single-mask multi-zone junction termination extension for high-voltage IGBT

机译:一种设计高压IGBT的单掩模多区域结终端扩展的简单方法

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摘要

A simple method to design the single-mask multi-zone junction termination extension (MZJTE) (SM-MZJTE) for high-voltage insulated-gate bipolar transistor (IGBT) is presented and experimentally demonstrated. By assuming that the p-type SM-MZJTE region is completely depleted and the equipotential lines are circular arcs for simplicity, an analytical model of the selective function is derived from the charge balance and the geometrical relations. As the blocking capability is sensitive to the implantation dose, the Boron segregation at Si-SiO2 interface has also been taken into consideration in this model. According to the analytical model, high-voltage IGBTs and test devices with edge termination of SM-MZJTE are fabricated. IGBTs with edge termination implantation dose of 3×1012 cm−2 show highest average breakdown voltage of 3.79 kV (about 92% of the parallel plane breakdown voltage).
机译:提出并实验证明了一种设计高压绝缘栅双极型晶体管(IGBT)的单掩模多区域结终端扩展(MZJTE)(SM-MZJTE)的简单方法。为了简单起见,通过假设p型SM-MZJTE区域已完全耗尽并且等势线是圆弧,从电荷平衡和几何关系得出了选择函数的分析模型。由于阻挡能力对注入剂量敏感,因此在该模型中还考虑了Si-SiO2界面处的硼偏析。根据分析模型,制造了带有IGBT边缘终止的高压IGBT和测试装置。边缘终止注入剂量为3×10 12 cm -2 的IGBT的平均击穿电压最高,为3.79 kV(约为平行平面击穿电压的92%)。

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