As the power density requirements of dc-to-dc converters continue to increase, board real estate is becoming more valuable than ever, increasing the demand for power MOSFET packages with a smaller footprint and improved thermal and electrical efficiency. Advances in silicon technology have helped to reduce on-resistance (r_Ds(on)) for a given die size to almost negligible levels. Now the challenge is to optimize die size and device packaging to maximize converter performance. New small package options help to reduce conduction losses and switching losses of the primary side switch in dc-to-dc converters while allowing higher power density levels.
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