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Band Materials with Coating Based on Composite Powder Systems

机译:基于复合粉末体系的带涂层涂料

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摘要

The paper discusses investigation results of band materials formed by a continuous electrocontact sintering of thin-film powder coatings (50 to 100 μm) to the band metal substrate (copper and its alloys, steel). The coating materials were high-filled (up to 30 mass%) copper-graphite powder systems. The composition and structure of powder systems were investigated in association with triboengineering and physico-mechanical characteristics of band composites and their behavior in friction contact. Structural changes are shown in the composite at varying filler concentration in the metal matrix. Investigation has been carried out in the effect of technological factors of electrocontact sintering (force of electrode pressing, velocity of material motion, strength of sintering current, etc.) on the structure and triboengineering characteristics of thin-film coatings from copper-graphite systems. The calculated optimum parameters of electrocontact sintering ensured most perfect characteristics of thin-film copper-graphite coatings with 1-4% porosity. Most essential parameters proved to be strength of sintering current and force of electrode pressing.
机译:本文讨论了通过将薄膜粉末涂料(50至100μm)与带状金属基材(铜及其合金,钢)进行连续电接触烧结而形成的带状材料的研究结果。涂料是高填充(最高30质量%)的铜-石墨粉末体系。结合摩擦工程学和带状复合材料的物理力学特性及其在摩擦接触中的行为,研究了粉末体系的组成和结构。在金属基质中填充剂浓度变化的情况下,复合材料的结构发生变化。已经研究了电接触烧结的技术因素(电极压紧力,材料运动速度,烧结电流强度等)对铜-石墨体系薄膜涂层的结构和摩擦工程特性的影响。计算出的电接触烧结最佳参数确保了孔隙率为1-4%的薄膜铜-石墨涂层的最完美特性。事实证明,最重要的参数是烧结电流强度和电极压紧力。

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