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Process to Fabricate High Performance Solid Phase Crystallized n-Type and p-Type Thin Film Transistors on Glass Substrate

机译:在玻璃基板上制造高性能固相结晶的n型和p型薄膜晶体管的工艺

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摘要

We have perfected a low thermal budget process (<600 deg C) to fabricate high performance n and p type TFT's. They are elaborated in polycrystalline silicon on low cost glass substrates for Active Matrice Liquid Crystal Display (AMLCD) applications. Amorphous silicon layers are deposited by Low Pressure Chemical Vapor Deposition (LPCVD) and subsquently solid phase crystallized. The flexibility of LPCVD with the con5trol of the in-situ doping makes changes possible in the process. Indeed, this deposition technique allows the improvement of the polysilicon active layer/doped polysilicon layer interface. Drain and source regions are in-situ doped using phosphine for n type and diborane for p type transistors. The gate insoluator is an Atmospheric Pressure Chemical Vapor Deposited (APCVD) SiO_2 layer. The process does not include any hydrogenation step.
机译:我们已经完善了低热预算工艺(<600摄氏度),以制造高性能的n型和p型TFT。它们在用于有源矩阵液晶显示器(AMLCD)应用的低成本玻璃基板上的多晶硅中进行了精加工。非晶硅层通过低压化学气相沉积(LPCVD)沉积,然后固相结晶。 LPCVD的灵活性以及原位掺杂的控制使工艺中的改变成为可能。实际上,该沉积技术允许改进多晶硅有源层/掺杂的多晶硅层界面。漏极和源极区域使用磷化原位掺杂,用于n型,乙硼烷用于p型晶体管。栅极绝缘体是大气压化学气相沉积(APCVD)SiO_2层。该方法不包括任何氢化步骤。

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