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ROLE OF Ag~+ ION CONCENTRATION ON METAL-ASSISTED CHEMICAL ETCHING OF SILICON

机译:Ag〜+离子浓度在硅辅助金属化学刻蚀中的作用

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摘要

Metal-assisted silicon etching in HF/H_2O_2/H_2O solution with silver ions as catalyst was investigated. It is found that the geometric parameters of silicon nanostructured layers are determined by the silver-catalyst concentration. Spontaneous stop of the process during etching at low Ag~+ ion concentration is explained by insoluble Ag_2SiO_3 formation.
机译:研究了以银离子为催化剂的HF / H_2O_2 / H_2O溶液中的金属辅助硅刻蚀。发现硅纳米结构层的几何参数由银催化剂的浓度决定。通过不溶性Ag_2SiO_3的形成解释了在低Ag〜+离子浓度下蚀刻过程中自发停止的过程。

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  • 来源
  • 会议地点 Vladivostok(RU)
  • 作者单位

    National Research University of Electronic Technology, Zelenograd, Moscow, 124498, Russia;

    National Research University of Electronic Technology, Zelenograd, Moscow, 124498, Russia;

    National Research University of Electronic Technology, Zelenograd, Moscow, 124498, Russia;

    National Research University of Electronic Technology, Zelenograd, Moscow, 124498, Russia;

    National Research University of Electronic Technology, Zelenograd, Moscow, 124498, Russia;

  • 会议组织
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    silicon; chemical etching; silver; catalyst;

    机译:硅;化学蚀刻银;催化剂;
  • 入库时间 2022-08-26 14:26:23

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