An Accurate Thermal Resistance Testing Method for Power Semiconductors

机译：功率半导体的精确热阻测试方法

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In this paper,the effect of temperature nonlinearities of the packaging materials on the thermal resistance measurement was analyzed by FEM tools.Based on the simulation results,a novel thermal resistance testing method for power semiconductors was proposed to improve the accuracy compared to the published JESD51-14 standard.Experimental results verified the effectiveness of the proposed method.

机译：本文通过有限元工具分析了包装材料温度非线性对热阻测量的影响。在仿真结果的基础上，提出了一种新型的功率半导体热阻测试方法，以提高精度。 -14标准。实验结果验证了该方法的有效性。

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来源
《PCIM Asia 2015 International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management》|2015年|257-263|共7页
会议地点 Shanghai(CN)
作者
Jin Zhang; Zhijie Qiu; Xuhui Wen;
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作者单位

Institute of Electrical Engineering,Chinese Academy of Sciences,China;

Key Laboratory of Power Electronics and Electric Drive,Chinese Academy of Sciences,China;

Beijing Engineering Laboratory of Electrical Drive System Power Electronic Device Packaging Technology,China;

Institute of Electrical Engineering,Chinese Academy of Sciences,China;

Key Laboratory of Power Electronics and Electric Drive,Chinese Academy of Sciences,China;

Beijing Engineering Laboratory of Electrical Drive System Power Electronic Device Packaging Technology,China;

Institute of Electrical Engineering,Chinese Academy of Sciences,China;

Key Laboratory of Power Electronics and Electric Drive,Chinese Academy of Sciences,China;

Beijing Engineering Laboratory of Electrical Drive System Power Electronic Device Packaging Technology,China;

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正文语种 eng
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An Accurate Thermal Resistance Testing Method for Power Semiconductors

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