An Accurate Thermal Resistance Testing Method for Power Semiconductors

机译：功率半导体的精确热阻测试方法

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In this paper, the effect of temperature nonlinearities of the packaging materials on the thermal resistance measurement was analyzed by FEM tools. Based on the simulation results, a novel thermal resistance testing method for power semiconductors was proposed to improve the accuracy compared to the published JESD51-14 standard. Experimental results verified the effectiveness of the proposed method.

机译：本文通过有限元工具分析了包装材料温度非线性对热阻测量的影响。根据仿真结果，提出了一种新型的功率半导体热阻测试方法，以提高与公布的JESD51-14标准相比的精度。实验结果证明了该方法的有效性。

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《International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management》|2015年|1-7|共7页
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Zhang Jin; Zhang Jin; Zhang Jin; Qiu Zhijie; Qiu Zhijie; Qiu Zhijie; Wen Xuhui; Wen Xuhui; Wen Xuhui;
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An Accurate Thermal Resistance Testing Method for Power Semiconductors

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