FLIP CHIP TRANSFER MEMS ON A TRANSPARENT SUBSTRATE FOR OPTICAL APPLICATIONS

摘要

In this paper, a new flip chip assembly and silicon removal technology to transfer optical MEMS onto a transparent substrate is reported. Successful transfer of a novel 2-dimensional MEMS-controllable microlens array to a quartz substrate has been demonstrated. A thin Photo-bisbenzocyclobutene (Photo-BCB) film was coated on the quartz substrate for protection during release, which resulted in no observable etching damage to the gold interconnects. Substrate preparation, microlens fabrication, MEMS design, integration of MEMS with microlens array, the procedures for flip chip transfer, parameter effects and experiment results are presented and discussed. This technology was demonstrated as a reliable and advanced packaging approach for hybrid integration of optical MEMS.