DETERMINING INTERFACIAL DELAMINATION PROPAGATION OF VIALUX~(TM) 81/COPPER INTERFACE IN MULTILAYERED SYSTEM-ON-PACKAGE (SOP) INTEGRATED SUBSTRATES

摘要

Research on System-On-Package (SOP) integrated substrate is being pursued at the Packaging Research Center (PRC) of Georgia Tech. The integrated substrate contains embedded thin-film passive components in a multilayered substrate to achieve higher performance, lower cost, smaller size and lighter weight. However, as in all multilayered structures, SOP integrated substrate could have higher interfacial stresses and therefore could have interfacial delamination induced by material properties mismatch under thermal loading, if not carefully designed and fabricated. The objective of this study is to investigate the propagation behavior of a interfacial delamination between ViaLux~(TM) 81 photo-definable dry film (PDDF) and copper with numerical simulations and experiments. The energy release rate (ERR) of a multilayered SOP substrate is obtained from numerical simulations. The viscoelastic material properties of ViaLux~(TM) 81 PDDF are also taken into consideration in the simulations. To study the onset and propagation behavior of an interfacial delamination, the interfacial fracture toughness and crack propagation resistance R-curve are obtained by specially designed sandwich type double cantilever beam (DCB) specimens. The ERR from the analysis is compared with the interfacial tougnhess, and the results indicate that there is minimal delamination growth under the given thermal load conditions.