Enabling MEMS Package-Device Co-design through Extraction of Compact Models

摘要

Microelectromechanical Systems (MEMS) by their nature as sensors and actuators require application specific packaging. MEMS devices are often inherently sensitive to stress induced by their packages and often need direct access to the environment. Therefore, understanding the influence of packaging on the MEMS device performance is critical to a successful coupled package-device codesign. Here, an automated package-device interaction simulator has been developed. Because of the large differences in size scales, a full 3-D FEM model of the combined package and device is impractical. THe simulator described here uses separate Finite Element Method (FEM) models for both the package and the device analysis and ties the results together through parametric behavioral package model. This technique allowe the generation of a library of package models that can be applied to any device model, and supports the codesign of application specific packaging and MEMS devices. Several examples illustrate the use of this technique including the generation of package models for a plastic surface-mount package and a ceramic DIP package. The MEMS devices that are examined in these packages include a lateral accelerometer, a vertical accelerometer and a torsional mirror device.