Flip-Chip on Laminate Reliability - Statistics and Failure Distributions

摘要

The drive towards high density, high performance packaging has accelerated interest in flip chip on laminate substrate packages. To achieve a reliable laminate flip chip package, the effects and interactions of the major design parameters must be understood. This paper investigates thermal cycling reliability of the following parameters/levels: chip size (16, 24mm), substrate CTE (glass reinforced,non-woven aramid reinforced), substrate thickness (0.38 and 1.6mm), and solder ball composition (37/63 and 95/5 Pb/Sn). Process development learnings are presented, as are results from the designed experiment. Additionally, the effects of different design parameters drving failure mechanisms with and without undefill delamination are discussed.