首页> 外文会议>Oxide films >Improvement in the Device Characteristics of Tin Oxide Thin-film Transistors by Adopting Ultralow-Pressure Sputtering
【24h】

Improvement in the Device Characteristics of Tin Oxide Thin-film Transistors by Adopting Ultralow-Pressure Sputtering

机译:采用超低压溅射改善氧化锡薄膜晶体管的器件特性

获取原文
获取原文并翻译 | 示例

摘要

Recently, transparent oxide semiconductor (TOS) TFTs like as ZnO, In_2O_3-ZnO, In_2O_3-Ga_2O_3-ZnO, and ZnO-SnO_2 have been intensively studied the back-plane of active matrix organic light emitting diode, active matrix liquid crystal display, and flexible display because they exhibit high mobility (> 5 cm~2/Vs) and good transparency in the visible range compared to the counterpart of amorphous Si TFTs. (1-4) Among of a various kind of TOSs, tin oxide have been firstly studied to apply the TFTs because of a proper band gap of 3 - 4 eV and a high optical transparency (> 85 %) in the visible light range. A few studies only are reported to the application of TFTs since 1964, their reports also were focused on the device characteristics. That is, all these tin oxide TFTs are depletion-mode devices, requiring the application of a gate voltage to turn them off. (5-7) Therefore, its electron density was more important factor to use the active channel of TFTs. In particular, lots of studies reported the electron density (N_d) of sputtered tin oxide film for the application of transparent conductive oxide has been related to the crystalline structure, oxidation state, and oxygen deficiency. (8-10) We have to try the novel approach to decrease Nj. According to the recently report of authors on the electrical properties of indium doped tin oxide (ITO) films as a function of sputtering pressure, their properties were closely related to the kinetic energy of sputtered particles. In this article, we report the fabrication of TFTs with the SnO_x film as channel layer by adopting ultralow-pressure sputtering. An ultralow-pressure sputtering (ULPS) method means that the sputtering pressure is below 1.3 * 10~(-1) Pa compared to an conventional sputtering pressure (CSP) of over 6.7*10~(-1) Pa. Decreasing sputtering pressure from 6.7*10~(-1) to 6.7*10~(-2) Pa significantly decreased the N_d from 10~(19) to 10~(17) cm~(-3), thereby producing a transistor
机译:最近,诸如ZnO,In_2O_3-ZnO,In_2O_3-Ga_2O_3-ZnO和ZnO-SnO_2之类的透明氧化物半导体(TOS)TFT已被深入研究了有源矩阵有机发光二极管,有源矩阵液晶显示器和柔性显示器,因为与非晶硅TFT相比,它们在可见光范围内显示出高迁移率(> 5 cm〜2 / Vs)和良好的透明度。 (1-4)在各种TOS中,由于在可见光范围内具有3-4eV的合适的带隙和高的光学透明性(> 85%),因此已经首先研究了氧化锡用于TFT。自1964年以来,仅对TFT的应用进行了一些研究,他们的报告也集中在器件特性上。也就是说,所有这些氧化锡TFT均为耗尽型器件,需要施加栅极电压以将其关闭。 (5-7)因此,其电子密度是使用TFT有源沟道的重要因素。特别是,许多研究报道了用于透明导电氧化物的溅射氧化锡膜的电子密度(N_d)与晶体结构,氧化态和氧缺乏有关。 (8-10)我们必须尝试新颖的方法来减少Nj。根据作者最近关于铟掺杂的氧化锡(ITO)膜的电性能随溅射压力变化的报告,其性能与溅射粒子的动能密切相关。在本文中,我们报告了通过采用超低压溅射法以SnO_x膜为沟道层的TFT的制造。超低压溅射(ULPS)方法意味着与传统的超过6.7 * 10〜(-1)Pa的溅射压力(CSP)相比,溅射压力低于1.3 * 10〜(-1)Pa。 6.7 * 10〜(-1)至6.7 * 10〜(-2)Pa可将N_d从10〜(19)降至10〜(17)cm〜(-3),从而产生晶体管

著录项

  • 来源
    《Oxide films》|2009年|p.119-126|共8页
  • 会议地点 Vienna(AT);Vienna(AT)
  • 作者单位

    Department of Materials Science and Engineering, and Inter- University Semiconductor Research Center, Seoul National University, Seoul, 151-744, Korea;

    Department of Materials Science and Engineering, and Inter- University Semiconductor Research Center, Seoul National University, Seoul, 151-744, Korea;

    Department of Materials Science and Engineering, and Inter- University Semiconductor Research Center, Seoul National University, Seoul, 151-744, Korea;

    Department of Materials Science and Engineering, and Inter- University Semiconductor Research Center, Seoul National University, Seoul, 151-744, Korea;

    Department of Materials Science and Engineering, Inha University, Incheon, 402-751, Korea;

    et al;

  • 会议组织
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 TQ050.91;
  • 关键词

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号